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产品 » RF产品 » RF Connectors » Knowledge base » Platings

Print viewPlatings

We are your plating technology specialist and your competent partner for developing and applying proper coatings for specific uses and conditions. This section explains the metallic plating used for the different HUBER+SUHNER connectors.

The demands towards connector platings are multiple, such as:

  • adding conductive material to supply sufficient current carrying capacity (good electrical and thermal conductivity)
  • diminish or eliminate surface oxidation/corrosion and provide protective coating for conductors
  • provide good contact between conductors
  • achieve a good solder or weld attachment surface
  • obtain a better wear resistance (abrasion resistance and hardness)

Our main platings are

  • gold
  • silver
  • SUCOPLATE® (H+S plating)
  • SUCOPRO (H+S plating)
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